• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a semiconductor device mounting test handler for mounting and testing a plurality of ICs (IC) and other memory chips constituting a module RAM, and includes a loading unit in which trays in which semiconductor devices to be tested are stored are loaded; And a test board configured to carry out a test by mounting the semiconductor devices transferred from the loading unit to the test board having a test board configured under the same environmental conditions as the module RAM, and the semiconductor devices tested in the test unit being transferred and tested. A handler comprising: an unloading unit which is classified and stacked according to a result, and a transfer device which transfers and mounts the semiconductor element of the loading unit to the test unit and the semiconductor element of the test unit into the unloading unit. A housing which is movable up and down in the front and whose front surface is open; A plurality of test boards arranged up and down on the housing and slidably moved through the open front surface of the housing and configured to be pulled out and drawn in, wherein the semiconductor device is mounted and the test is performed; Elevating means for elevating the housing up and down in the handler; And a withdrawal / retraction means for withdrawing and withdrawing the test board through the front surface of the housing.
    公开号:KR20020031463A
    申请号:KR1020000061948
    申请日:2000-10-20
    公开日:2002-05-02
    发明作者:이기현；김두철；송기영；신동진
    申请人:정문술；미래산업 주식회사；
    IPC主号:
    专利说明:

    Semiconductor Device Test Handler {Component Test Handler}
    [8] The present invention relates to a handler for testing a plurality of ICs and other memory chips constituting a module RAM, and in particular, prior to mounting a semiconductor device mounted on the module RAM to the module RAM. The present invention relates to a semiconductor device mounting test handler capable of testing environmental device performance by creating environmental conditions.
    [9] As is well known, a module RAM is a circuit composed of independent circuits by soldering and fixing a plurality of ICs and other semiconductor devices on a single substrate, and is mounted on a computer to perform core functions. After completion of the test, the product must be precisely tested before shipment. In general, only the module ram is independently tested and then directly mounted on the computer's motherboard to test the module.
    [10] However, the above-described modules have a plurality of semiconductor devices attached to one module RAM. If a defect occurs in the module test process, it is not possible to know which semiconductor device has an error. Even if an abnormality occurs in a device, a problem arises that a complicated process of disposing an expensive module or re-inspecting a semiconductor device on the module is performed.
    [11] Therefore, before mounting the semiconductor device in the module RAM, by mounting the semiconductor devices on a board formed under the same environmental conditions as the module RAM and testing the individual semiconductor devices, it is possible to prevent the defect of the module ram due to the abnormality of the semiconductor device. It was developed.
    [12] 1 is a block diagram of a conventional semiconductor device mounting test handler.
    [13] As shown in FIG. 1, the front part of the base 1 of the handler includes a loading unit 2 in which semiconductor elements to be tested are loaded in a tray, and the tested semiconductor elements are good or bad according to test results. The unloading part 3 which is classified and mounted according to various grades, etc., is arranged in an array.
    [14] In addition, a plurality of test boards 4 are arranged in the rear part of the base 1 of the handler to be constructed under the same environmental conditions as those of the actual module ram and perform tests under the same conditions as those in which the semiconductor device is mounted on the module ram. Each test board 4 is provided with a plurality of sockets 4a on which semiconductor elements are mounted.
    [15] In addition, the picker robot 5 which transfers and mounts the semiconductor elements to the loading part 2 and the test board 4 and the unloading part 3, etc., can be moved above the base 1 of the handler. It is installed.
    [16] Therefore, when the operation of the handler is started, the picker robot 5 grasps the elements to be tested of the loading unit 2, transfers them to the test board 4 at the rear, and mounts them in the socket 4a on the test board 4. You will run a test.
    [17] Subsequently, when the test is completed, the picker robot 5 grips the semiconductor elements of the test board 42 to classify and mount the picker robot 5 on the front unloading part 3 according to the test result.
    [18] However, in the conventional semiconductor device mounting test handler as described above, since the test boards 42 are arranged horizontally on the base, the movement time between the processes of the picker robot 5 for the test is far, so that the test time is relatively high. There was a problem.
    [19] Accordingly, the present invention has been made to solve the above problems, in the semiconductor device mounting test handler, to improve the structure of the test unit in which the test board is installed to a laminated structure that can be lifted up and down between the process of the semiconductor devices for testing It is an object of the present invention to provide a semiconductor device mounting test handler which can shorten the test time by reducing the moving range.
    [1] 1 is a schematic diagram showing the configuration of a conventional semiconductor device mounting test handler
    [2] FIG. 2 is a schematic diagram illustrating a configuration of a semiconductor device mounting test handler according to an exemplary embodiment of the present inventive concept.
    [3] FIG. 3 is a schematic side view illustrating the configuration and operation of a test unit of the semiconductor device mounting test handler of FIG. 2.
    [4] * Description of reference numerals in the main parts of the drawings *
    [5] 40-test part 41-housing
    [6] 42-Test Board 44-Electric Motor
    [7] 45a, 45b-sprocket 46-chain
    [20] In order to achieve the above object, the present invention includes a loading unit on which the trays containing the semiconductor elements to be tested are loaded, and a test board configured with the same environmental conditions as the module ram to transfer the semiconductor elements transferred from the loading unit. The test unit which is mounted on a test board to perform a test, the unloading unit in which the semiconductor elements tested in the test unit are transferred and classified according to the test result, and the semiconductor element of the loading unit as a test unit, the semiconductor element of the test unit A handler having a transfer device for transporting and mounting the rod to the unloading unit in a sequential manner, wherein the test unit comprises: a housing which is capable of lifting up and down in the handler and having a front face open; A plurality of test boards arranged up and down on the housing and slidably moved through the open front surface of the housing and configured to be pulled out and drawn in, wherein the semiconductor device is mounted and the test is performed; Elevating means for elevating the housing up and down in the handler; It provides a semiconductor device mounting test handler, characterized in that it comprises a withdrawal / retracting means for withdrawing and withdrawing the test board through the front surface of the housing.
    [21] According to the present invention as described above, since the housing mounted with the test board is raised and lowered up and down to receive the semiconductor element and perform the test, the moving range of the semiconductor element by the transfer device can be shortened.
    [22] Hereinafter, embodiments of a semiconductor device mounting test handler according to the present invention will be described in detail with reference to the accompanying drawings.
    [23] 2 and 3 illustrate the configuration of a semiconductor device mounting test handler according to the present invention. As shown in the drawing, the front side of the base 1 of the handler includes semiconductor devices to be tested in a state where they are stored in a tray. The loading unit 2 and the unloading unit 3 are arranged in which trays in which the tested semiconductor devices are classified and mounted in various grades such as good or bad according to the test result are arranged.
    [24] In addition, a test unit including a plurality of test boards 42 formed at the center of the back of the base 1 of the handler under the same conditions as those in which the semiconductor device is mounted on the module according to the same environmental conditions as the actual module. 40 is installed. Each test board 42 is provided with a plurality of sockets 4a (see FIG. 1) in which semiconductor devices are mounted.
    [25] In addition, the picker robot 5 which transfers and mounts the semiconductor elements to a designated position, such as the loading unit 2, the test unit 40, and the unloading unit 3, may be moved on the base 1 of the handler. It is installed.
    [26] On the other hand, the test boards 42 of the test unit 40 are arranged in a vertical stack structure in a box-shaped housing 41, the front surface of which is open, where the housing 41 is the base of the handler (1) It is configured to move up and down stepwise, and the test boards 42 are opened and closed in the housing 41 when the housing 41 is lifted and a predetermined test board 42 is positioned on the base 1. It is adapted to be drawn out of the housing 41 through the front surface.
    [27] In addition, the test unit 40 is an elevating means for elevating the housing 41 up and down, the electric motor 44 installed on the upper portion of the handler, and a pair of sprockets 45a, 45b) and a pair thereof are coupled to both outer sides of the housing 41 and driven up and down by the operation of the electric motor 44 to move up and down the housing 41 as a pair of chains 46. It is composed.
    [28] In addition, the test unit 40 is provided with a means for drawing out and withdrawing each test board 42 in the housing 41, the withdrawal / retracting means is fixed to the inner side of both sides of the housing 41 A guide member (not shown) installed at both sides of the test boards 42 so as to be slidably movable, and a forward and backward driving device for sliding the test board 42 forward and backward along the guide member (not shown). (Not shown) is installed.
    [29] Hereinafter, the operation of the semiconductor device mounting test handler configured as described above will be described.
    [30] First, when a user loads trays containing semiconductor elements to be tested in the loading unit 2 and starts the operation of the handler, the picker robot 5 on the upper side of the handler grips the semiconductor elements of the loading unit 2 to test it. The transfer to the portion 40.
    [31] At this time, in the test unit 40, the housing 41 is moved up and down by the lifting operation of the chain 46 by the electric motor 44, and the test board 42 to which the elements are mounted is the base of the handler. When it is located on the same plane as (1), it stops at this position.
    [32] Subsequently, the test board 42 positioned on the base 1 is moved along the guide member by a forward and backward driving device (not shown) to be drawn out through the open front surface of the housing 41, and the picker The robot 5 mounts the transferred semiconductor elements to the socket 4a of the test board 42.
    [33] When the mounting of the semiconductor device on the test board 42 is completed, the test board 42 is drawn back into the housing 41 to perform a test.
    [34] When the test of the semiconductor device is completed in the test unit 40 through the above process, the test board 42 is drawn out of the housing 41 again, and the picker robot 5 holds the tested semiconductor devices and freezes them. Transfer to the loading unit 3 is to be mounted according to the test results.
    [35] Meanwhile, in the above-described embodiment, the chain 46 is exemplified as the lifting means for elevating the housing 41. In addition, the housing may be elevated by properly configuring a ball screw, a belt, a cylinder, or the like.
    [36] In addition, in the above-described embodiment, the test unit has been described as having one housing, but two or more housings having the same configuration are alternately elevated up and down alternately, and may be configured to perform a test by mounting a semiconductor device. There will be.
    [37] As described above, according to the present invention, since the test boards in which the semiconductor devices are mounted and the test is performed are installed in a laminated structure in a housing configured to be movable up and down in the handler, the moving range of the transfer device for transferring the semiconductor devices can be shortened. As a result, the test time can be significantly shortened, thereby improving test efficiency.
    权利要求:
    Claims (5)
    [1" claim-type="Currently amended] A test unit including a loading unit on which trays containing semiconductor elements to be tested are loaded, and a test board configured with the same environmental conditions as the module ram to mount the semiconductor elements transferred from the loading unit to the test board to perform a test. And an unloading unit in which the semiconductor elements tested in the test unit are transferred and classified and loaded according to a test result, and the semiconductor elements of the loading unit are transferred to the test unit and the semiconductor elements of the test unit are transferred to the unloading unit. A handler having a transfer device,
    The test unit may include a housing which is liftable up and down in a handler and whose front face is open; A plurality of test boards arranged up and down on the housing and slidably moved through the open front surface of the housing and configured to be pulled out and drawn in, wherein the semiconductor device is mounted and the test is performed; Elevating means for elevating the housing up and down in the handler; And a drawing / retracting means for drawing and drawing the test board through the front surface of the housing.
    [2" claim-type="Currently amended] The semiconductor device mounting test handler according to claim 1, wherein the test unit is configured to perform a test by mounting a plurality of semiconductor devices by alternately lifting and lowering each other.
    [3" claim-type="Currently amended] The method of claim 1, wherein the lifting means comprises a lifting driving device and a lifting member coupled to the lifting driving device and fixed to an outer side of the housing to move up and down by operation of an electric motor, and to lift up and down the housing. Semiconductor device mounting test handler.
    [4" claim-type="Currently amended] 4. The semiconductor device mounting test handler according to claim 3, wherein the elevating member is connected to the elevating driving device via a pair of sprockets and one piece is fixed to an outer portion of the housing.
    [5" claim-type="Currently amended] According to claim 1, The withdrawal / retracting means, the guide member is installed to be fixed to the inner side of both sides of the housing and coupled to both sides of the test board to guide the forward and backward sliding movement of the test board, and the test board A semiconductor device mounting test handler, comprising a forward and backward driving device for moving forward and backward.
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    同族专利:
    公开号 | 公开日
    KR100380962B1|2003-04-26|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2000-10-20|Application filed by 정문술, 미래산업 주식회사
    2000-10-20|Priority to KR20000061948A
    2002-05-02|Publication of KR20020031463A
    2003-04-26|Application granted
    2003-04-26|Publication of KR100380962B1
    优先权:
    申请号 | 申请日 | 专利标题
    KR20000061948A|KR100380962B1|2000-10-20|2000-10-20|Component Test Handler|
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